Why the Ice Pad Does Not Pump Out Like Thermal Paste

Created by Brandon Rowlett, Modified on Mon, 1 Jun at 2:37 PM by Brandon Rowlett

Traditional thermal paste can gradually shift, dry out, or “pump out” from between the CPU and cooler during repeated heating and cooling cycles. Over time, this can reduce contact quality and lead to higher temperatures.


The Carbice Ice Pad is designed differently.


Instead of relying on a liquid or semi-liquid compound, the Ice Pad uses a solid carbon nanotube structure that maintains its shape and position under normal operating conditions. This helps provide more stable long-term contact between the CPU and cooler surface.


Because the material is not designed to flow like thermal paste, it is far less susceptible to the pumping effect that can occur after repeated thermal expansion and contraction cycles inside a PC.


This design helps improve long-term thermal reliability while also reducing the mess and maintenance associated with traditional pastes.


Benefits of the Ice Pad design include:


• Stable long-term thermal performance

• Reduced risk of drying or separation

• Cleaner installation and removal

• Reusable material design

• More consistent contact over time


Like all thermal interface materials, proper installation and mounting pressure are still important for achieving optimal performance.

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